Hitachi CMI760 Thickness Gauges

$9,000.00

Hitachi CMI760 Thickness Gauges is a specialized, micro-resistance-based instrument designed for high-resolution, non-destructive measurement of ultra-thin copper thickness on PCB surfaces, often used for quality control in HDI manufacturing.

Hitachi CMI760 Thickness Gauges

Hitachi CMI760 Thickness Gauges accepts multiple probe types to meet almost any PCB application, including surface copper and through-hole applications.

Our Hitachi CMI760 Thickness Gauges comes standard with the SRP-4 probe and an advanced statistical package for interpretation of test data.

This instrument is highly-expandable, capable of both micro-resistance and eddy current testing for the accurate and precise measurement of copper. Optional accessories are available to measure thru-hole copper thickness.

SRP-4 PROBE
The CMI760 includes a tethered SRP-4 Probe with user-replaceable tips for added convenience and its more cost effective. This probe consists of four pins encased securely in a patented design for durability and resistance to breakage and wear. A see-through casing allows for easy placement of the probe on small traces. The tethered cable is ideal for field applications plus its small footprint is convenient and user-friendly.

OPTIONAL ETP PROBE
Using our ETP Probe the CMI760 operates with eddy current for through-hole measurements. This probe generates accurate readings regardless of the board’s multiple layers, working equally well on double-sided and multilayer boards, before and after etch,
even with tin and tin/lead resist. It also provides a temperature compensation feature, for measurement of the board immediately after it is lifted from the plating tank.

GAUGE SPECIFICATIONS
Dimensions: in : 11 1/2 (W) x 10 1/2 (D) x 5 1/2 (H)
cm: 29.21 (W) x 26.67 (D) x 13.97 (H).
Weight: 6 lbs. (2.7 kg).
Unit: Select from mils, µm, µin, mm, in.,
or % as units for display.
Display: Large LCD 480 (H) x 320 (V) pixels

CMI95M   CMI165CMI511(CMI500)CMI563CMI760(CMI700)
TechniqueMicroresistance microresistanceEddy currenymicroresistancemicroresistance
Copper Foil×
Copper Clad Laminate(CCL)×
Copper-Surface××
Copper-Fineline××
Copper Thru-hole×××optional
Temperature Compensation××√ (ETP Probe)
Replacement Probe Tip××√ (SRP-4 Probe)
Unit Selectionoz or ummil or ummil or ummil or ummil or um
      
Thickness Range8 indicator lights

1/8-4 oz

5-140 um

Electroless Cu

0.01-0.5 mil

0.25-12.7 um

Electroplated Cu

0.1-10 mil

2-254 um

0.08-4.0 mil

2-102 um

Electroless Cu

0.01-0.5 mil

0.25-12.7 um

Electroplated Cu

0.1-6 mil

3-152 um

Surface Cu

0.01-10 mil

0.25-254 um

Thru-hole Cu

0.05-4 mil

1-102um

 

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