1.PP Sticky Roller Overview

Adhesive Roller, a cutting-edge cleaning consumable developed by the UK-based Teknek company, represents a breakthrough in contamination management for precision electronics manufacturing. Designed specifically for PCB, FPC, glass substrate, and other high-purity surfaces, this system achieves dust-free production through an innovative dual-component mechanism: a silicone-based Sticky Roller paired with a replaceable adhesive paper roll (peel-off paper). The core functionality enables efficient dust transfer from production surfaces to the adhesive paper, maintaining optimal cleanliness throughout manufacturing processes.

2.Technical Mechanism

The system operates through a two-stage dust transfer process:

Primary Capture: The silicone sticky roller (Shore A hardness 40±5) makes direct contact with the target surface, capturing particles through molecular adhesion forces. Its micro-textured surface increases contact area by 300% compared to conventional rollers, enabling efficient removal of 0.3μm and larger particles.

Secondary Transfer: The adhesive paper roll, featuring a specially formulated pressure-sensitive adhesive (PSA), contacts the sticky roller through a protective peel-off layer. This transfers captured contaminants from the roller to the paper surface with 99.97% efficiency. Regular replacement of the saturated paper roll (recommended every 8-12 production hours) restores the system’s cleaning capacity.

Pp Sticky Roller 3

Technical data

Name	sticky paper roll(adhesive paper roll)
Usage	For PCB cleaning Machine
Base material	PP pearlescent film
Thickness	0.085mm
Tensile strength	crosswise>=100N,lengthways>=50N
elongation at break	crosswise<=80%,lengthways<=200%
Thermal shrinkage rate	crosswise<=2.0%,lengthways<=4.0%
Glue	Acrylic pressure sensitive adhesive
Specification	W650mm*L20mtr(width50mm—1360mm)
Color	White
ID	1.5″(38MM),3″(76.2MM),ECT
Working Temp	-10℃-90℃
Packing	4rolls/carton

sticky paper roll Technical Advantages

High-Performance Adhesion

Viscosity range: 800-1,200g/25mm (ASTM D3330 compliant)

Particle capture efficiency: ≥99.7% for particles ≥0.5μm

Zero adhesive transfer upon peeling, eliminating secondary contamination risks

Electrostatic Discharge (ESD) Protection

Surface resistance: ≤1×10⁹Ω (IEC 61340-5-1 standard)

Effective prevention of static-induced damage to MOSFETs, MEMS sensors, and other electrostatic-sensitive devices

Operational Reliability

Stable peel force: 0.5-1.5N/cm ensures consistent adhesive performance

Temperature tolerance: -10℃ to 60℃ operational range

Humidity resistance: Maintains adhesion efficacy at 10-90% RH

Cost Efficiency

Single roll coverage: 500-1,000m² (300mm width)

Lifespan extension: 3× longer than conventional tacky mats

Material consumption reduction: 45% less adhesive waste compared to gel-based systems

3.Performance Data

PCB Manufacturing:

Particle reduction: 99.7% for ≥0.5μm contaminants

Yield improvement: 15-20% increase in first-pass yield

Cost savings: 30% lower operating expenses vs. traditional wiping methods

Semiconductor Packaging:

Compliance: Meets Class 100 (ISO 5) cleanroom standards

Lead frame cleaning: Residual particle count ≤5 particles/cm²

Wafer handling: Static decay time <0.1s (per MIL-STD-3010)

Display Panel Production:

Glass substrate cleaning: Surface particle density ≤10 particles/cm²

Polarizer lamination: Defect rate reduction from 2.1% to 0.3%

Adhesive roll durability: 2-3 weeks continuous use in 8-hour shifts

4.Application Scenarios

PCB/FPC Manufacturing

Critical processes: Post-etch cleaning, solder mask pre-treatment, SMT pad preparation

Defect mitigation: Eliminates short circuits caused by conductive particles (e.g., copper flakes) and cold solder joints from organic contaminants

Semiconductor Packaging

Key applications: Wafer dicing debris removal, lead frame surface purification, die attach pre-cleaning

Compliance requirement: ESD protection per JEDEC J-STD-033 standards

Display Technologies (LCD/OLED)

Process optimization: Glass substrate final cleaning, polarizer bonding surface preparation

Quality control: Particle counter validation (TSI 9306) for ≤10 particles/cm² compliance

Precision Industries

Optical manufacturing: Lens coating pre-cleaning (particle size control ≤5μm)

Printing: High-resolution plate cleaning (eliminates dot gain defects)

Pharmaceutical: Cleanroom equipment maintenance (validated per ISO 14644-1)

Environmental & Economic Benefits

Sustainability: Reduces solvent use by 80% compared to wet cleaning methods

Waste management: Single-component adhesive rolls enable 100% recyclability

ROI: Payback period of 6-8 months through yield improvements and reduced rework costs

FAQ

Q1: What are the advantages of sticky paper rolls compared to traditional cleaning methods (such as dust-free cloth wiping)?

Higher efficiency: dust-free cloths need to be wiped repeatedly, and dead corners are easily missed; sticky paper rolls achieve full coverage cleaning through roller contact.

Avoid secondary pollution: dust-free cloth wiping may leave residual fibers or chemicals, and sticky paper rolls have no residue after peeling.

Data-based control: The cleaning area and particle capture rate of a single roll can be counted to facilitate quality traceability.

Q2: How to choose a suitable sticky paper roll model?

According to viscosity requirements: high viscosity (1000-1200 g/25 mm) is suitable for heavy pollution scenarios (such as after PCB etching), and low viscosity (800-1000 g/25 mm) is suitable for sensitive components (such as wafers).

Match by width: The width of the sticky paper roll must be consistent with the sticky roller (common specifications: 100 mm, 200 mm, 300 mm).

According to the antistatic level: the semiconductor field needs to choose a model with a surface resistance of ≤10⁸ ohms.

Q3: What factors affect the service life of adhesive rolls?

Pollution level: High dust environment (such as welding workshop) requires more frequent replacement.

Workshop temperature and humidity: High temperature and high humidity may cause the viscosity of the glue to decrease. It is recommended to control the temperature and humidity at 22℃±2℃ and 55%±10% relative humidity.

Operation specification: Too fast peeling speed or uneven roller pressure may shorten the life.

Q4: How environmentally friendly is Teknek adhesive roll?

Recyclable materials: The adhesive roll base material is PP film, and the peeling paper is release paper, both of which can be recycled and reused.

No harmful substances: The glue is RoHS and REACH certified and does not contain halogens or heavy metals.