Acrylic Hardener for PCB microsection

Acrylic Hardener is a two-component epoxy or acrylic resin system designed for metallographic analysis and material microstructure observation. The typical representative is metallographic glue powder (acrylic resin base) and matching curing agent. Its core function is to form a transparent, high-hardness, low-shrinkage matrix through rapid curing, firmly bond the microscopic sections of metals, ceramics and other materials to the slide, while maintaining the original microscopic morphology of the sections, providing stable support for subsequent grinding, polishing and microscopic observation.

Fast curing: Preliminary curing is completed in 10-15 minutes, significantly shortening the experimental cycle;

High transparency: transmittance after curing is >90%, ensuring the clarity of microscopic imaging;

Low viscosity and excellent fluidity: can penetrate into the tiny pores of the slice (such as cracks and grain boundaries) to form a defect-free bond;

High hardness (Shore 60-80 degrees): resistant to grinding and polishing, avoiding deformation of the matrix during observation;

Low shrinkage: volume change before and after curing is <1%, preventing the slice from warping or cracking due to stress;

Easy to operate: After the two components are mixed, they can be directly dripped without complicated pretreatment.

Metal material detection: In the grain size analysis and inclusion identification of materials such as steel, aluminum alloy, and titanium alloy, the curing agent fixes slices as thin as 20-50μm on a glass slide. After grinding and polishing, the organizational structure is observed by optical microscope or scanning electron microscope (SEM).

Failure analysis: For broken parts and corroded samples, the curing agent can quickly prepare cross-sectional slices to assist in locating the crack source and analyzing the distribution of corrosion products.

Coating and plating research: Used to fix the cross-section of multi-layer coatings or electroplating layers, measure the thickness of each layer and the interface bonding state.

Composite material interface analysis: In carbon fiber reinforced resin matrix composites (CFRP), the curing agent can prepare slices perpendicular to the fiber direction to observe the interface debonding and pore defects between the fiber and the matrix.

Ceramic material microstructure characterization: For ceramics such as alumina and silicon nitride, the curing agent supports the preparation of high-hardness slices for analyzing grain size, porosity and sintering process defects.

Chip packaging reliability test: The curing agent is used to fix the cross-sectional samples of flip chips (Flip Chip) or ball grid arrays (BGA), and the solder joints and interconnect layers are exposed by grinding to evaluate the failure mode under thermal cycling or mechanical stress.

3D integrated circuit (3D IC) analysis: In the cross-section preparation of multi-layer stacked chips, the curing agent needs to meet the low shrinkage rate to avoid interlayer misalignment and ensure high-precision microscopic imaging.

Rock thin section preparation: The curing agent bonds the rock fragments to the slide, and after grinding to a thickness of 30μm, it is used for mineral composition identification and petrographic analysis under a polarizing microscope.

No thermal damage: avoid material phase change or organizational changes caused by high-temperature mounting;

High efficiency: fast curing at room temperature, suitable for batch sample preparation;

Wide compatibility: can bond a variety of materials such as metal, ceramics, glass, plastic, etc.;

Environmental protection: low volatile organic compound (VOC) emissions, in line with laboratory safety regulations.