1.PCB Artwork Protective Film Overview

PCB Artwork Protective Film is a PE film with excellent light transmission and a layer of very strong adhesive and a smooth polyester stretching diaphragm,Protection Film has good UV light resistance and excellent light transmission, and has the function of preventing scratching and anti-static, avoiding dust, and improving the lifespan of silver halide film and protect the lithographic film negative and increase the service life of the film

The PCB Artwork Protective Film acts as a Surface Guard for the diazo film(silver halid film). It is typically a Self-Adhesive Film applied to large PCB panels immediately after processes like etching or final surface treatment, ensuring the delicate copper features remain pristine before soldering or final assembly.

Definition: A polymer-based protection film designed with a specific Adhesive Strength to temporarily shield the PCB surface, providing PCB protection against physical abrasion, dust, and corrosive elements, with the ability for Residue-Free Peel-off.
Search Intent: Users often search for “pcb film” or “protection film price” when looking for cost-effective ways to minimize in-process damage and rework.

2. Material Technology and Key Characteristics

The composition of PCB Artwork Protective Film must balance adhesion, protection, and clean removal, especially within the demanding manufacturing environment.

1. Material (PE Protective Film & PET Protective Film)

Polyethylene PCB Film (PE): Commonly used for general PCB Shipping Film and temporary handling protection due to its flexibility and low cost. It often features a Clear Protective Film or Blue Protective Film color.
PET Protective Film: Preferred for applications requiring higher tensile strength, temperature resistance, or chemical stability, making it suitable for more critical PCB Process Film stages.
PI Protective Film: While not typical for large area artwork protection, PI Protective Film (Polyimide) is used for highly localized, high-heat applications like Gold Finger Protection Film during reflow or specialized Solder Masking Film.

2. Adhesive Technology

The use of a precise Low-Tack Adhesive (often acrylic- or silicone-based) is crucial. Unlike strong industrial adhesives, this film must guarantee a Residue-Free Peel after removal, as any residue can interfere with subsequent plating or soldering processes.

3. Specialty Features

Anti-Static Protective Film / ESD Protective Film: Essential for protecting static-sensitive electronic components and traces from electrostatic discharge during handling.
Anti-Corrosion Film: Contains volatile corrosion inhibitors (VCIs) to shield exposed copper surfaces from oxidation during long-term storage or shipment in humid environments.

3. Key Features and Advantages

The specialized features of these films translate directly into cost savings and quality assurance.

Feature	Advantage in PCB Manufacturing	Value for Purchasers
Residue-Free Peel	Prevents contamination of gold plating pads or solderable areas.	Eliminates costly cleaning steps and prevents soldering defects.
Controlled Adhesive Strength	Allows the film to adhere during complex processes but detach easily.	Reduces labor time for removal and minimizes the risk of lifting delicate traces.
Wide Process Tolerance	Selection of High Temperature Protective Film options (e.g., Silicone Adhesive Film) available for heat-intensive stages.	Enables use in light PCB Rework Masking scenarios without melting or leaving carbonized residue.
Visual Inspection	Transparent PCB Film allows operators to visually inspect the underlying traces and surface quality without removing the film.	Speeds up in-process inspection and reduces manual handling.

4. Application Scenarios

The film is deployed across various stages where the PCB is vulnerable to physical or chemical damage:

Transport and Storage: Applied as a Polyethylene PCB Film (PE) after final surface finish (e.g., ENIG or HASL) to prevent scratches, dust, and environmental tarnish before assembly.
Assembly Preparation: Used before component placement to protect solderable areas while surrounding surfaces are handled or cleaned.
Gold Finger Protection: Specific, thicker Gold Finger Protection Film is used during immersion gold or nickel plating to mask areas not intended for the process.
Rework and Repair: Applied as a Temporary Masking Film around a defective area during spot cleaning or thermal rework to prevent damage to nearby components or traces.

Material	PET
Size	20″150mtr,22″150mtr,24″*150mtr and other size customized
Usage	protect the artwork diazo film and silver halide film, it can used on both solder mask and circuits process
MOQ	1 set

FAQ

Q1、Compared with ordinary PE protective film, how does APF protective film solve the problem of “insufficient scratch resistance”?

Pain points of ordinary PE film:

The material is soft but has low hardness (<1H), which is easily scratched by tools or equipment, resulting in blurred circuit patterns.

Advantages of APF protective film:

Using PET substrate + hard coating technology, the surface hardness reaches more than 2H, and the scratch resistance is improved by 300%;

Laboratory simulation tests show that there are still no scratches after rubbing 50 times under 1kg pressure, ensuring the integrity of fine circuits.

Q2、Compared with electrostatic adsorption film, how to optimize the “dust-proof effect” of APF protective film?

Pain points of electrostatic adsorption film:

Relying on static electricity to adsorb dust, the adsorption force decreases after long-term use, resulting in PCB surface contamination.

Advantages of APF protective film:

The surface is treated with antistatic coating (surface resistance 10⁶–10⁹Ω), which actively repels dust;

Tests in dust-free workshops show that the amount of particle attachment is reduced by 85% after 24 hours of exposure, significantly reducing the cost of PCB cleaning.