{"id":4476,"date":"2026-10-27T08:35:16","date_gmt":"2026-10-27T08:35:16","guid":{"rendered":"https:\/\/welleltron.com\/?p=4476"},"modified":"2026-10-27T08:45:34","modified_gmt":"2026-10-27T08:45:34","slug":"measure-pth-copper-thickness-cmi700","status":"publish","type":"post","link":"https:\/\/welleltron.com\/ru\/blog\/measure-pth-copper-thickness-cmi700\/","title":{"rendered":"How to Measure PTH Copper Thickness Accurately Using CMI700"},"content":{"rendered":"<style>.kb-table-of-content-nav.kb-table-of-content-id4476_825202-59 .kb-table-of-content-wrap{padding-top:var(--global-kb-spacing-sm, 1.5rem);padding-right:var(--global-kb-spacing-sm, 1.5rem);padding-bottom:var(--global-kb-spacing-sm, 1.5rem);padding-left:var(--global-kb-spacing-sm, 1.5rem);}.kb-table-of-content-nav.kb-table-of-content-id4476_825202-59 .kb-table-of-contents-title-wrap{padding-top:0px;padding-right:0px;padding-bottom:0px;padding-left:0px;}.kb-table-of-content-nav.kb-table-of-content-id4476_825202-59 .kb-table-of-contents-title{font-weight:regular;font-style:normal;}.kb-table-of-content-nav.kb-table-of-content-id4476_825202-59 .kb-table-of-content-wrap .kb-table-of-content-list{font-weight:regular;font-style:normal;margin-top:var(--global-kb-spacing-sm, 1.5rem);margin-right:0px;margin-bottom:0px;margin-left:0px;}<\/style>\n\n\n<h2 class=\"wp-block-heading\">What Does CMI700 Measure in a Plated Through-Hole?<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">With a compatible configuration and ETP probe, the CMI700 measures the thickness of copper deposited on the wall of a plated through-hole (PTH). This copper forms the conductive connection between PCB layers.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The ETP probe uses eddy-current technology for through-hole copper measurement. It serves a different purpose from the SRP-4 probe, which measures surface copper using micro-resistance technology.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">A PTH copper thickness reading should not be confused with:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Finished hole diameter:<\/strong> the size of the opening after plating.<\/li>\n\n\n\n<li><strong>PCB thickness:<\/strong> the overall thickness of the board.<\/li>\n\n\n\n<li><strong>Surface copper thickness:<\/strong> the copper thickness on the board\u2019s outer faces.<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">Step-by-Step Operating Procedure for Accurate PTH Measurements<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">1. Pre-Inspection Setup and Environmental Conditioning<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Before powering on the measurement equipment or introducing test panels to the station, establish baseline stability:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Environmental Control:<\/strong> Verify that the inspection workstation operates within a temperature-controlled, low-vibration quality control environment to eliminate thermal expansion and mechanical drift during testing.<\/li>\n\n\n\n<li><strong>Panel Cleaning and Drying:<\/strong> Ensure production panels are fully rinsed, chemically neutralized, and thoroughly dried. Residual plating chemicals, moisture, or organic residues inside hole barrels act as partial electrical insulators and distort micro-resistance readings.<\/li>\n\n\n\n<li><strong>Gauge Warm-Up:<\/strong> Power on the <a href=\"https:\/\/welleltron.com\/thickness-gauges\/\">coating thickness gauge<\/a> and allow the internal circuitry to stabilize according to the manufacturer\u2019s recommended warm-up period.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">2. Probe Inspection and Hardware Preparation<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">The physical integrity of the measurement probe directly determines signal transmission fidelity.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Visual Tip Inspection:<\/strong> Examine the <a href=\"https:\/\/welleltron.com\/test-equipment\/etp-probe\/hitachi-cmi700-etp-probe\/\">ETP probe<\/a> under an optical stereomicroscope. Check for bent spring pins, accumulated debris, or micro-chipping on the contact points.<\/li>\n\n\n\n<li><strong>Secure Connection:<\/strong> Insert the probe cable connector into the gauge&#8217;s dedicated input port, tightening locking mechanisms completely to prevent signal resistance fluctuations caused by loose pins.<\/li>\n\n\n\n<li><strong>Zero Calibration Verification:<\/strong> Place the probe onto a certified zero-reference block or bare copper reference surface to confirm that baseline resistance values return to zero before testing production coupons.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">3. Step-by-Step Measurement Execution<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Execute the physical testing sequence with strict mechanical consistency:<\/p>\n\n\n\n<ol start=\"1\" class=\"wp-block-list\">\n<li><strong>Alignment:<\/strong> Position the panel flat and stable on an insulated test surface. Lower the probe directly into the target <a href=\"https:\/\/welleltron.com\/kb\/through-hole-assembly\/\">through-hole<\/a> at a strict 90\u00ba perpendicular angle. Never approach or insert the probe at an angle, as side-loading bends internal spring contacts and skews contact resistance.<\/li>\n\n\n\n<li><strong>Applied Force:<\/strong> Guide the probe downward until the internal spring housing bottoms out smoothly against the panel surface. Apply consistent, gentle vertical pressure; avoid heavy manual downward force or sudden impact drops that prematurely degrade probe tips.<\/li>\n\n\n\n<li><strong>Dwell Time and Stabilization:<\/strong> Hold the probe steady inside the hole barrel for 1 to 2 seconds to allow the electrical testing loop to stabilize and register a stable digital lock on the gauge display.<\/li>\n\n\n\n<li><strong>Multi-Point Sampling Matrix:<\/strong> Inspect multiple holes across a structured spatial layout on each panel (e.g., top-left, center, bottom-right) to capture potential electroplating thickness variations across the board surface.<\/li>\n<\/ol>\n\n\n\n<h3 class=\"wp-block-heading\">4. Data Recording and Compliance Verification<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Transform raw numerical readings into actionable quality control decisions:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Compare Against Specifications:<\/strong> Cross-reference recorded average thickness values against engineering drawing specifications and IPC standards (e.g., minimum average copper thickness requirements for Class 2 vs. Class 3 boards).<\/li>\n\n\n\n<li><strong>Flag Out-of-Tolerance Readings:<\/strong> If any individual hole reading falls below the minimum acceptable threshold, quarantine the panel immediately and flag the corresponding plating line tank for chemical or current density audit.<\/li>\n\n\n\n<li><strong>Log Documentation:<\/strong> Record batch numbers, operator IDs, calibration verification timestamps, and measured thickness values into the factory quality management system (QMS) for traceability.<\/li>\n<\/ul>\n\n\n\n<h3 class=\"wp-block-heading\">5. Post-Test Maintenance and Storage<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Proper post-inspection care preserves hardware accuracy for subsequent shifts:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Tip Cleaning:<\/strong> Wipe probe contact tips gently using a lint-free wipe moistened with isopropyl alcohol (IPA) to remove any microscopic oxidation or handling oils accumulated during testing.<\/li>\n\n\n\n<li><strong>Safe Storage:<\/strong> Place the probe into a dedicated protective foam case or resting cradle when not in use. Never leave probes lying unprotected on metal workbenches where rolling or accidental drops can bend delicate tips.<\/li>\n<\/ul>\n\n\n\n<figure class=\"wp-block-image size-full is-resized\"><img fetchpriority=\"high\" decoding=\"async\" width=\"850\" height=\"835\" src=\"https:\/\/welleltron.com\/wp-content\/uploads\/2025\/12\/HITACHI-cmi760.jpg\" alt=\"Hitachi Cmi760\" class=\"wp-image-2169\" style=\"aspect-ratio:1.0179735963098457;width:574px;height:auto\" srcset=\"https:\/\/welleltron.com\/wp-content\/uploads\/2025\/12\/HITACHI-cmi760.jpg 850w, https:\/\/welleltron.com\/wp-content\/uploads\/2025\/12\/HITACHI-cmi760-300x295.jpg 300w, https:\/\/welleltron.com\/wp-content\/uploads\/2025\/12\/HITACHI-cmi760-768x754.jpg 768w, https:\/\/welleltron.com\/wp-content\/uploads\/2025\/12\/HITACHI-cmi760-12x12.jpg 12w, https:\/\/welleltron.com\/wp-content\/uploads\/2025\/12\/HITACHI-cmi760-600x589.jpg 600w\" sizes=\"(max-width: 850px) 100vw, 850px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\"> Preparing the Gauge: Selecting and Connecting ETP Probes<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Achieving repeatable measurements begins with selecting the correct probe hardware for specific panel configurations.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">CMI700 Probe Selection &amp; Hole-Size Compatibility Matrix<\/h3>\n\n\n\n<figure class=\"wp-block-table\"><table><thead><tr><td><strong>Probe Type \/ Configuration<\/strong><\/td><td><strong>Suitable Hole Diameter Range<\/strong><\/td><td><strong>Key Application Scenario<\/strong><\/td><td><strong>Primary Operational Advantage<\/strong><\/td><\/tr><\/thead><tbody><tr><td><strong>Standard ETP Probe<\/strong><\/td><td>Standard PTH diameters (0.8 mm to 1.5mm)<\/td><td>Standard double-sided and rigid multi-layer panels<\/td><td>High durability for routine production line QC<\/td><\/tr><tr><td><strong>Fine-Tip ETP Probe<\/strong><\/td><td>Micro-vias and dense arrays (0.2 mm to 0.6 mm)<\/td><td>High-Density Interconnect (HDI) boards<\/td><td>Delicate contact tips engineered for tight clearance<\/td><\/tr><tr><td><strong>Extended Reach Probe<\/strong><\/td><td>Thick backplanes (> 3.2 mm board thickness)<\/td><td>Heavy industrial and telecommunications backplanes<\/td><td>Longer insertion depth without spring-housing binding<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p class=\"wp-block-paragraph\">Before starting inspection runs, verify physical connections:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Ensure the ETP probe connector engages firmly with the gauge&#8217;s dedicated input port without twisting the internal signal pins.<\/li>\n\n\n\n<li>Inspect the spring-loaded probe mechanism under magnification to verify that the micro-contacts are clean and unbent. Loose cable connections or damaged internal signal wiring directly introduce stray baseline resistance into measurement loops.<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">Standard Calibration Procedure<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Environmental thermal shifts and electronic baseline drift require routine calibration before running quality checks.<\/p>\n\n\n\n<ol start=\"1\" class=\"wp-block-list\">\n<li><strong>Clean Calibration Standards:<\/strong> Wipe certified calibration standards (standards foils and reference boards) using lint-free wipes dampened with isopropyl alcohol (IPA) to eliminate surface oils and dust.<\/li>\n\n\n\n<li><strong>Execute Zero Calibration:<\/strong> Place the ETP probe vertically onto a non-plated reference substrate or bare copper foil as prompted by the CMI700 system menu to establish baseline zero resistance.<\/li>\n\n\n\n<li><strong>Calibrate Against Known Foils:<\/strong> Place the certified reference standard matching target copper thickness ranges (e.g., 25\u03bcm) into the calibration jig. Take multiple test readings across the standard until the displayed average matches the certified reference value.<\/li>\n\n\n\n<li><strong>Standardization Schedule:<\/strong> Re-calibrate the gauge at the start of every operator shift and immediately whenever an ETP probe is replaced or exposed to significant room temperature changes.<\/li>\n<\/ol>\n\n\n\n<h2 class=\"wp-block-heading\">Overcoming Probe Tip Wear and Reading Drift Challenges<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">High-volume factory operations subject ETP probes to continuous mechanical abrasion against rough copper surfaces.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Tip Wear Mechanics:<\/strong> Repeated insertion into thousands of drilled and plated holes gradually rounds off the microscopic contact tips of the probe. As contact geometry shifts, contact resistance rises, causing the gauge to report false low copper thickness values or unstable readings.<\/li>\n\n\n\n<li><strong>Detecting Reading Drift:<\/strong> Track calibration reference checks on a control chart. If standard reference readings shift systematically upward or downward over consecutive shifts, the probe tip is degrading.<\/li>\n\n\n\n<li><strong>Replacement Protocol:<\/strong> Inspect probe contact tips under a stereomicroscope every week. Replace worn or contaminated probes immediately when daily zero checks fail to stabilize within certified reference limits.<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">Handling High Aspect Ratios and Small-Diameter Through-Holes<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Measuring micro-vias and high aspect ratio holes (where board thickness greatly exceeds hole diameter) introduces mechanical clearance obstacles.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Centering and Insertion:<\/strong> Slender probes designed for small holes (&lt; 0.5 mm) flex easily under manual force. Flexing causes probe tips to contact the top rim of the hole rather than seating fully inside the plated barrel.<\/li>\n\n\n\n<li><strong>Using Precision Guides:<\/strong> Mount the CMI700 ETP probe into a vertical manual positioning stand or alignment jig when measuring fine-pitch HDI panels. Mechanical alignment guides hold the probe perfectly centered over micro-holes, eliminating manual hand tremors and keeping measurement variation low.<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">FAQ CMI700  Copper Thickness<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">Can an SRP-4 probe measure PTH copper thickness?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Hitachi describes SRP-4 as a surface copper thickness probe and ETP as a through-hole copper probe. Use the probe and procedure intended for the feature being measured. <\/p>\n\n\n\n<h3 class=\"wp-block-heading\">What is the minimum hole size an ETP probe can measure?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Confirm the limit for the exact probe and instrument configuration. Do not use a specification from another model or assume that physical access establishes measurement capability.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">How often should CMI700 calibration be checked?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Use the interval and event-based checks defined by your quality system, applicable instructions, and measurement history. Routine verification and periodic calibration are different activities; a universal interval is not established here.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Why do CMI700 readings fluctuate when testing the same PTH repeatedly?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Flushing readings are usually caused by improper operator hand alignment, dirty or oxidized probe contact tips, or residual chemical contamination inside the hole barrel that interferes with electrical contact.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Can CMI700 replace microsection inspection?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">That depends on the inspection objective and approved requirements. A thickness measurement should not be treated as a substitute for examining hole-wall structure or defects unless the alternative method has been demonstrated and accepted for that purpose<\/p>\n\n\n<style>.wp-block-kadence-advancedheading.kt-adv-heading4476_999d42-fb, .wp-block-kadence-advancedheading.kt-adv-heading4476_999d42-fb[data-kb-block=\"kb-adv-heading4476_999d42-fb\"]{font-style:normal;}.wp-block-kadence-advancedheading.kt-adv-heading4476_999d42-fb mark.kt-highlight, .wp-block-kadence-advancedheading.kt-adv-heading4476_999d42-fb[data-kb-block=\"kb-adv-heading4476_999d42-fb\"] mark.kt-highlight{font-style:normal;color:#f76a0c;-webkit-box-decoration-break:clone;box-decoration-break:clone;padding-top:0px;padding-right:0px;padding-bottom:0px;padding-left:0px;}.wp-block-kadence-advancedheading.kt-adv-heading4476_999d42-fb img.kb-inline-image, .wp-block-kadence-advancedheading.kt-adv-heading4476_999d42-fb[data-kb-block=\"kb-adv-heading4476_999d42-fb\"] img.kb-inline-image{width:150px;vertical-align:baseline;}<\/style>\n<p class=\"kt-adv-heading4476_999d42-fb wp-block-kadence-advancedheading\" data-kb-block=\"kb-adv-heading4476_999d42-fb\"><\/p>\n","protected":false},"excerpt":{"rendered":"<p>CMI700 coating thickness gauge utilizes micro-resistance technology for non-destructive inspection of copper thickness inside holes. <\/p>","protected":false},"author":1,"featured_media":2168,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_uag_custom_page_level_css":"","_kad_blocks_custom_css":"","_kad_blocks_head_custom_js":"","_kad_blocks_body_custom_js":"","_kad_blocks_footer_custom_js":"","_kad_post_transparent":"","_kad_post_title":"","_kad_post_layout":"","_kad_post_sidebar_id":"","_kad_post_content_style":"","_kad_post_vertical_padding":"","_kad_post_feature":"","_kad_post_feature_position":"","_kad_post_header":false,"_kad_post_footer":false,"footnotes":""},"categories":[126],"tags":[],"class_list":["post-4476","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-hitachi"],"taxonomy_info":{"category":[{"value":126,"label":"Hitachi Test equipment"}]},"featured_image_src_large":["https:\/\/welleltron.com\/wp-content\/uploads\/2025\/12\/CMI700.png",849,844,false],"author_info":{"display_name":"lucaismilelove@gmail.com","author_link":"https:\/\/welleltron.com\/ru\/blog\/author\/luciasmilelovegmail-com\/"},"comment_info":0,"category_info":[{"term_id":126,"name":"Hitachi Test equipment","slug":"hitachi","term_group":0,"term_taxonomy_id":126,"taxonomy":"category","description":"","parent":1,"count":10,"filter":"raw","cat_ID":126,"category_count":10,"category_description":"","cat_name":"Hitachi Test 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