{"id":4296,"date":"2026-10-23T03:27:19","date_gmt":"2026-10-23T03:27:19","guid":{"rendered":"https:\/\/welleltron.com\/?page_id=4296"},"modified":"2026-10-23T04:27:05","modified_gmt":"2026-10-23T04:27:05","slug":"solder-paste","status":"publish","type":"page","link":"https:\/\/welleltron.com\/de\/kb\/solder-paste\/","title":{"rendered":"Solder Paste"},"content":{"rendered":"<style>.kb-table-of-content-nav.kb-table-of-content-id4296_490c3b-f1 .kb-table-of-content-wrap{padding-top:var(--global-kb-spacing-sm, 1.5rem);padding-right:var(--global-kb-spacing-sm, 1.5rem);padding-bottom:var(--global-kb-spacing-sm, 1.5rem);padding-left:var(--global-kb-spacing-sm, 1.5rem);}.kb-table-of-content-nav.kb-table-of-content-id4296_490c3b-f1 .kb-table-of-contents-title-wrap{padding-top:0px;padding-right:0px;padding-bottom:0px;padding-left:0px;}.kb-table-of-content-nav.kb-table-of-content-id4296_490c3b-f1 .kb-table-of-contents-title{font-weight:regular;font-style:normal;}.kb-table-of-content-nav.kb-table-of-content-id4296_490c3b-f1 .kb-table-of-content-wrap .kb-table-of-content-list{font-weight:regular;font-style:normal;margin-top:var(--global-kb-spacing-sm, 1.5rem);margin-right:0px;margin-bottom:0px;margin-left:0px;}<\/style>\n\n\n<h2 class=\"wp-block-heading\">1. What Is Solder Paste?<\/h2>\n\n\n<style>.wp-block-kadence-advancedheading.kt-adv-heading4296_2146bf-b9_0, .wp-block-kadence-advancedheading.kt-adv-heading4296_2146bf-b9_0[data-kb-block=\"kb-adv-heading4296_2146bf-b9_0\"]{font-style:normal;}.wp-block-kadence-advancedheading.kt-adv-heading4296_2146bf-b9_0 mark.kt-highlight, .wp-block-kadence-advancedheading.kt-adv-heading4296_2146bf-b9_0[data-kb-block=\"kb-adv-heading4296_2146bf-b9_0\"] mark.kt-highlight{font-style:normal;color:#f76a0c;-webkit-box-decoration-break:clone;box-decoration-break:clone;padding-top:0px;padding-right:0px;padding-bottom:0px;padding-left:0px;}.wp-block-kadence-advancedheading.kt-adv-heading4296_2146bf-b9_0 img.kb-inline-image, .wp-block-kadence-advancedheading.kt-adv-heading4296_2146bf-b9_0[data-kb-block=\"kb-adv-heading4296_2146bf-b9_0\"] img.kb-inline-image{width:150px;vertical-align:baseline;}<\/style>\n<p class=\"kt-adv-heading4296_2146bf-b9_0 wp-block-kadence-advancedheading\" data-kb-block=\"kb-adv-heading4296_2146bf-b9_0\">Solder paste is a homogeneous, thixotropic mixture of microscopic metal solder alloy powder suspended in a viscous flux medium.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Solder paste contains two essential elements:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Solder alloy powder<\/strong>, which becomes the metallic connection.<\/li>\n\n\n\n<li><strong>Flux medium<\/strong>, which supports deposition, helps remove oxides, and protects surfaces during heating.<\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\">Manufacturers offer different combinations of alloy, powder size, and flux chemistry for specific deposition and assembly requirements.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">2. How Does Solder Paste Work?<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Solder paste performs different functions during printing, placement, heating, and cooling.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Deposition<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">A stencil printer, dispenser, or compatible jetting system places paste at the intended connections.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Component Placement<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">The paste\u2019s tack helps retain components before reflow. Placement must provide appropriate contact without excessively spreading the deposit.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Heating and Reflow<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">As the assembly heats, the flux system conditions the joining surfaces and helps limit oxidation. The solder particles melt and coalesce, wetting suitable pads and component terminations.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The profile must suit the alloy, flux, components, and board. An oven setpoint is not a substitute for a measured assembly profile.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Cooling<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">The molten solder solidifies into the joint. Flux residue may remain, depending on the formulation and cleaning procedure.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Printed paste volume is not the same as final solder-metal volume.<\/strong> The flux medium does not become solid solder. This distinction matters particularly when calculating deposits for large joints or through-hole connections.<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img fetchpriority=\"high\" decoding=\"async\" width=\"783\" height=\"522\" src=\"https:\/\/welleltron.com\/wp-content\/uploads\/2026\/10\/Solder-Paste.jpg\" alt=\"Solder Paste\" class=\"wp-image-4298\" srcset=\"https:\/\/welleltron.com\/wp-content\/uploads\/2026\/10\/Solder-Paste.jpg 783w, https:\/\/welleltron.com\/wp-content\/uploads\/2026\/10\/Solder-Paste-300x200.jpg 300w, https:\/\/welleltron.com\/wp-content\/uploads\/2026\/10\/Solder-Paste-768x512.jpg 768w, https:\/\/welleltron.com\/wp-content\/uploads\/2026\/10\/Solder-Paste-18x12.jpg 18w, https:\/\/welleltron.com\/wp-content\/uploads\/2026\/10\/Solder-Paste-600x400.jpg 600w\" sizes=\"(max-width: 783px) 100vw, 783px\" \/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\">3. Main Types of Solder Paste<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Solder paste should be classified along several independent dimensions. A powder classification does not identify the alloy, and a \u201cno-clean\u201d label does not describe particle size.<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table><thead><tr><th>Classification<\/th><th>Common Examples<\/th><th>Main Selection Question<\/th><\/tr><\/thead><tbody><tr><td><strong>Alloy system<\/strong><\/td><td>Tin-lead, tin-silver-copper, and application-specific lower-temperature alloys<\/td><td>Does the alloy meet assembly, service, and project requirements?<\/td><\/tr><tr><td><strong>Flux system<\/strong><\/td><td>No-clean, water-soluble, and rosin-based formulations<\/td><td>Can the residues remain, or must they be removed?<\/td><\/tr><tr><td><strong>Powder classification<\/strong><\/td><td>Type 3, Type 4, Type 5, and finer grades<\/td><td>Can the paste deposit reliably through the intended geometry?<\/td><\/tr><tr><td><strong>Deposition method<\/strong><\/td><td>Stencil printing, dispensing, or jetting<\/td><td>Is the formulation approved for the selected equipment?<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h3 class=\"wp-block-heading\">Alloy Selection<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Choose the alloy according to component compatibility, thermal limits, joint requirements, and applicable customer specifications.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">A lower melting temperature may reduce processing demands, but it does not automatically produce equivalent mechanical or service performance. Assess the actual alloy and application.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Flux Selection<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">No-clean formulations are intended for applications where qualified residues may remain. Whether cleaning can be omitted still depends on the actual assembly and requirements.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Water-soluble formulations require an appropriate cleaning process according to the product instructions. Do not assume every such residue can be left indefinitely before cleaning.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Rosin-based products also require review of their specific classification and cleaning requirements. These categories are broad descriptions rather than complete acceptance criteria.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Powder Size<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Higher powder type numbers generally indicate finer particle classifications. Finer powder can support smaller deposition features, but the correct choice depends on the aperture, formulation, and process.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">4. PCB and Stencil Design Considerations<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Solder paste performance depends on the relationship between the PCB footprint, solder mask, stencil aperture, and component termination.<\/strong><\/p>\n\n\n\n<p class=\"wp-block-paragraph\">These features should be reviewed together before production.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Pad Geometry<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Start with the component manufacturer\u2019s recommended land pattern and the assembler\u2019s approved design rules.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Pads must support the required connection while accounting for fabrication tolerances and component variation. Avoid enlarging pads simply to obtain more solder without checking spacing, wetting balance, and neighboring features.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Solder Mask Openings<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Solder mask defines exposed areas; the stencil defines paste deposition. The mask opening and paste aperture therefore do not have to match each other or the copper pad exactly.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Review mask registration and separation between adjacent pads. Unintended exposed copper can change where molten solder flows.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Stencil Thickness and Apertures<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">For an idealized stencil opening: Vaperture=Aapertures\u00d7Tstencil<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">However, the actual deposited volume also depends on transfer efficiency. Increasing stencil thickness may increase theoretical volume while making small apertures harder to print consistently.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Area Ratio and Paste Release<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">The stencil area ratio compares the opening area with its wall area:Area Ratio=Aperture Opening Area\/Aperture Wall Area<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">For a rectangular aperture with length L, width W, and stencil thickness Area Ratio = LW\/2t(L+W)<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">A lower ratio generally makes release more demanding. The practical limit depends on the stencil, paste, surface finish, and printing process; it should not be treated as one universal number.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Thermal Pads and Vias<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Follow package-specific recommendations for exposed pads. Segmented apertures may be appropriate, but their geometry and coverage require validation.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Open vias can divert solder from the intended connection. Specify their treatment and review how they affect deposition, outgassing, and the finished joint.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">5. Pin Solder Paste (Pin-in-Paste \/ Intrusive Reflow) Technology<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>Pin in paste<\/strong> (also known as Pin-in-Paste or Intrusive Reflow Solder Technology) is an innovative manufacturing method that eliminates the need for a secondary wave soldering or manual soldering step for through-hole components.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>How It Works:<\/strong> Through-hole pads are designed with extra-large paste volume capacity. <strong>Solder paste<\/strong> is dispensed or stencil-printed directly over and into the plated <a href=\"https:\/\/welleltron.com\/kb\/through-hole-assembly\/\">through-holes (PTH)<\/a>. Through-hole component leads are then inserted into the wet paste, and the entire board undergoes standard surface-mount reflow.<\/li>\n\n\n\n<li><strong>The Reflow Mechanism:<\/strong> During thermal profiling, the paste melts, and capillary action draws the liquid solder down into the barrel, achieving complete vertical fill without a solder wave machine.<\/li>\n\n\n\n<li><strong>Key Advantages:<\/strong>\n<ul class=\"wp-block-list\">\n<li>Combines SMT and THT production into a single reflow oven pass.<\/li>\n\n\n\n<li>Eliminates capital expenditure and maintenance associated with dedicated <a href=\"https:\/\/welleltron.com\/kb\/wave-soldering\/\">wave soldering<\/a> equipment.<\/li>\n\n\n\n<li>Reduces thermal shock on delicate components by processing the entire board in a controlled, gradual reflow profile.<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">6. Best Practices for Storing and Handling Solder Paste<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">Because solder paste is a chemically active and temperature-sensitive compound, strict handling protocols are mandatory:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Refrigeration:<\/strong> Store unopened jars or cartridges in a dedicated refrigerator maintained at 0\u2103 to 10\u2103  to prevent flux separation and alloy oxidation.<\/li>\n\n\n\n<li><strong>Thawing Procedure:<\/strong> Remove paste from refrigeration at least 4 to 24 hours before use. <strong>Never open a cold jar<\/strong> immediately; letting it reach ambient room temperature naturally prevents moisture condensation from forming on the paste.<\/li>\n\n\n\n<li><strong>Mixing and Kneading:<\/strong> Stir mechanically (or via automated planetary mixers) for the manufacturer-specified duration to restore ideal thixotropic viscosity before loading onto the printer.<\/li>\n<\/ul>\n\n\n\n<h2 class=\"wp-block-heading\">7. Frequently Asked Questions<\/h2>\n\n\n\n<h3 class=\"wp-block-heading\">Is Solder Paste the Same as Flux?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">No. Solder paste contains solder alloy powder and flux. Flux alone generally requires a separate source of solder metal.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Is Finer Powder Always Better?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">No. Select powder size with the deposition geometry, formulation, equipment, and required process stability.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Can All Through-Hole Components Use Pin-in-Paste?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">No. The component must be approved for reflow, and the design must accommodate adequate paste deposition and acceptable finished connections.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Can the Paste Layer Match the Copper Pads Exactly?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">Sometimes, but not automatically. Aperture geometry should reflect the package, stencil thickness, paste release, and required solder volume.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Does No-Clean Paste Mean No Further Evaluation Is Needed?<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">No. Confirm that residues and the actual process meet the product requirements, including any cleaning, testing, coating, or bonding operations.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>1. What Is Solder Paste? Solder paste is a homogeneous, thixotropic mixture of microscopic metal solder alloy powder suspended in a viscous flux medium. Solder paste contains two essential elements: Manufacturers offer different combinations of alloy, powder size, and flux chemistry for specific deposition and assembly requirements. 2. How Does Solder Paste Work? Solder paste&#8230;<\/p>","protected":false},"author":1,"featured_media":0,"parent":2541,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_uag_custom_page_level_css":"","_kad_blocks_custom_css":"","_kad_blocks_head_custom_js":"","_kad_blocks_body_custom_js":"","_kad_blocks_footer_custom_js":"","_kad_post_transparent":"","_kad_post_title":"","_kad_post_layout":"left","_kad_post_sidebar_id":"","_kad_post_content_style":"","_kad_post_vertical_padding":"","_kad_post_feature":"","_kad_post_feature_position":"","_kad_post_header":false,"_kad_post_footer":false,"footnotes":""},"categories":[],"tags":[],"class_list":["post-4296","page","type-page","status-publish","hentry"],"taxonomy_info":[],"featured_image_src_large":false,"author_info":{"display_name":"lucaismilelove@gmail.com","author_link":"https:\/\/welleltron.com\/de\/blog\/author\/luciasmilelovegmail-com\/"},"comment_info":0,"_hostinger_reach_plugin_has_subscription_block":false,"_hostinger_reach_plugin_is_elementor":false,"spectra_custom_meta":{"_uagb_previous_block_counts":["a:90:{s:21:\"uagb\/advanced-heading\";i:0;s:15:\"uagb\/blockquote\";i:0;s:12:\"uagb\/buttons\";i:0;s:18:\"uagb\/buttons-child\";i:0;s:19:\"uagb\/call-to-action\";i:0;s:15:\"uagb\/cf7-styler\";i:0;s:11:\"uagb\/column\";i:0;s:12:\"uagb\/columns\";i:0;s:14:\"uagb\/container\";i:0;s:21:\"uagb\/content-timeline\";i:0;s:27:\"uagb\/content-timeline-child\";i:0;s:14:\"uagb\/countdown\";i:0;s:12:\"uagb\/counter\";i:0;s:8:\"uagb\/faq\";i:0;s:14:\"uagb\/faq-child\";i:0;s:10:\"uagb\/forms\";i:0;s:17:\"uagb\/forms-accept\";i:0;s:19:\"uagb\/forms-checkbox\";i:0;s:15:\"uagb\/forms-date\";i:0;s:16:\"uagb\/forms-email\";i:0;s:17:\"uagb\/forms-hidden\";i:0;s:15:\"uagb\/forms-name\";i:0;s:16:\"uagb\/forms-phone\";i:0;s:16:\"uagb\/forms-radio\";i:0;s:17:\"uagb\/forms-select\";i:0;s:19:\"uagb\/forms-textarea\";i:0;s:17:\"uagb\/forms-toggle\";i:0;s:14:\"uagb\/forms-url\";i:0;s:14:\"uagb\/gf-styler\";i:0;s:15:\"uagb\/google-map\";i:0;s:11:\"uagb\/how-to\";i:0;s:16:\"uagb\/how-to-step\";i:0;s:9:\"uagb\/icon\";i:0;s:14:\"uagb\/icon-list\";i:0;s:20:\"uagb\/icon-list-child\";i:0;s:10:\"uagb\/image\";i:0;s:18:\"uagb\/image-gallery\";i:0;s:13:\"uagb\/info-box\";i:0;s:18:\"uagb\/inline-notice\";i:0;s:11:\"uagb\/lottie\";i:0;s:21:\"uagb\/marketing-button\";i:0;s:10:\"uagb\/modal\";i:0;s:18:\"uagb\/popup-builder\";i:0;s:16:\"uagb\/post-button\";i:0;s:18:\"uagb\/post-carousel\";i:0;s:17:\"uagb\/post-excerpt\";i:0;s:14:\"uagb\/post-grid\";i:0;s:15:\"uagb\/post-image\";i:0;s:17:\"uagb\/post-masonry\";i:0;s:14:\"uagb\/post-meta\";i:0;s:18:\"uagb\/post-taxonomy\";i:0;s:18:\"uagb\/post-timeline\";i:0;s:15:\"uagb\/post-title\";i:0;s:20:\"uagb\/restaurant-menu\";i:0;s:26:\"uagb\/restaurant-menu-child\";i:0;s:11:\"uagb\/review\";i:0;s:12:\"uagb\/section\";i:0;s:14:\"uagb\/separator\";i:0;s:11:\"uagb\/slider\";i:0;s:17:\"uagb\/slider-child\";i:0;s:17:\"uagb\/social-share\";i:0;s:23:\"uagb\/social-share-child\";i:0;s:16:\"uagb\/star-rating\";i:0;s:23:\"uagb\/sure-cart-checkout\";i:0;s:22:\"uagb\/sure-cart-product\";i:0;s:15:\"uagb\/sure-forms\";i:0;s:22:\"uagb\/table-of-contents\";i:0;s:9:\"uagb\/tabs\";i:0;s:15:\"uagb\/tabs-child\";i:0;s:18:\"uagb\/taxonomy-list\";i:0;s:9:\"uagb\/team\";i:0;s:16:\"uagb\/testimonial\";i:0;s:14:\"uagb\/wp-search\";i:0;s:19:\"uagb\/instagram-feed\";i:0;s:10:\"uagb\/login\";i:0;s:17:\"uagb\/loop-builder\";i:0;s:18:\"uagb\/loop-category\";i:0;s:20:\"uagb\/loop-pagination\";i:0;s:15:\"uagb\/loop-reset\";i:0;s:16:\"uagb\/loop-search\";i:0;s:14:\"uagb\/loop-sort\";i:0;s:17:\"uagb\/loop-wrapper\";i:0;s:13:\"uagb\/register\";i:0;s:19:\"uagb\/register-email\";i:0;s:24:\"uagb\/register-first-name\";i:0;s:23:\"uagb\/register-last-name\";i:0;s:22:\"uagb\/register-password\";i:0;s:30:\"uagb\/register-reenter-password\";i:0;s:19:\"uagb\/register-terms\";i:0;s:22:\"uagb\/register-username\";i:0;}"],"_edit_lock":["1792740764:1"],"rank_math_internal_links_processed":["1"],"rank_math_seo_score":["78"],"rank_math_focus_keyword":["Solder Paste"],"rank_math_title":["Solder Paste"],"_edit_last":["1"],"_uag_custom_page_level_css":[""],"_kad_blocks_custom_css":[""],"_kad_blocks_head_custom_js":[""],"_kad_blocks_body_custom_js":[""],"_kad_blocks_footer_custom_js":[""],"_kad_post_transparent":[""],"_kad_post_title":[""],"_kad_post_layout":["left"],"_kad_post_sidebar_id":[""],"_kad_post_content_style":[""],"_kad_post_vertical_padding":[""],"_kad_post_feature":[""],"_kad_post_feature_position":[""],"_kad_post_header":[""],"_kad_post_footer":[""],"footnotes":[""],"_elementor_edit_mode":[""],"_elementor_template_type":[""],"_elementor_data":[""],"_elementor_conditions":["a:0:{}"],"rank_math_og_content_image":["a:2:{s:5:\"check\";s:32:\"dbadd09efd1bc28f8bc98126157e81de\";s:6:\"images\";a:1:{i:0;i:4298;}}"],"_wp_page_template":["default"],"_uag_css_file_name":["uag-css-4296.css"],"_elementor_page_assets":["a:0:{}"],"_uag_page_assets":["a:9:{s:3:\"css\";s:260:\".uag-blocks-common-selector{z-index:var(--z-index-desktop) !important}@media(max-width: 976px){.uag-blocks-common-selector{z-index:var(--z-index-tablet) !important}}@media(max-width: 767px){.uag-blocks-common-selector{z-index:var(--z-index-mobile) !important}}\";s:2:\"js\";s:0:\"\";s:18:\"current_block_list\";a:29:{i:0;s:23:\"kadence\/tableofcontents\";i:1;s:12:\"core\/heading\";i:2;s:23:\"kadence\/advancedheading\";i:3;s:14:\"core\/paragraph\";i:4;s:9:\"core\/list\";i:5;s:14:\"core\/list-item\";i:6;s:10:\"core\/image\";i:7;s:10:\"core\/table\";i:8;s:9:\"core\/code\";i:9;s:10:\"core\/group\";i:10;s:12:\"core\/columns\";i:11;s:14:\"core\/tag-cloud\";i:12;s:17:\"core\/social-links\";i:13;s:10:\"core\/video\";i:14;s:15:\"core\/media-text\";i:15;s:10:\"core\/audio\";i:16;s:10:\"core\/verse\";i:17;s:14:\"core\/pullquote\";i:18;s:17:\"core\/preformatted\";i:19;s:12:\"core\/details\";i:20;s:14:\"core\/page-list\";i:21;s:18:\"core\/legacy-widget\";i:23;s:16:\"core\/social-link\";i:24;s:12:\"kadence\/form\";i:25;s:14:\"kadence\/search\";i:26;s:16:\"kadence\/iconlist\";i:27;s:16:\"kadence\/listitem\";i:28;s:12:\"kadence\/icon\";i:29;s:19:\"kadence\/single-icon\";}s:8:\"uag_flag\";b:0;s:11:\"uag_version\";s:10:\"1792852206\";s:6:\"gfonts\";a:0:{}s:10:\"gfonts_url\";s:0:\"\";s:12:\"gfonts_files\";a:0:{}s:14:\"uag_faq_layout\";b:0;}"]},"uagb_featured_image_src":{"full":false,"thumbnail":false,"medium":false,"medium_large":false,"large":false,"1536x1536":false,"2048x2048":false,"trp-custom-language-flag":false,"woocommerce_thumbnail":false,"woocommerce_single":false,"woocommerce_gallery_thumbnail":false},"uagb_author_info":{"display_name":"lucaismilelove@gmail.com","author_link":"https:\/\/welleltron.com\/de\/blog\/author\/luciasmilelovegmail-com\/"},"uagb_comment_info":0,"uagb_excerpt":"1. What Is Solder Paste? Solder paste is a homogeneous, thixotropic mixture of microscopic metal solder alloy powder suspended in a viscous flux medium. Solder paste contains two essential elements: Manufacturers offer different combinations of alloy, powder size, and flux chemistry for specific deposition and assembly requirements. 2. How Does Solder Paste Work? Solder paste...","_links":{"self":[{"href":"https:\/\/welleltron.com\/de\/wp-json\/wp\/v2\/pages\/4296","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/welleltron.com\/de\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/welleltron.com\/de\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/welleltron.com\/de\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/welleltron.com\/de\/wp-json\/wp\/v2\/comments?post=4296"}],"version-history":[{"count":3,"href":"https:\/\/welleltron.com\/de\/wp-json\/wp\/v2\/pages\/4296\/revisions"}],"predecessor-version":[{"id":4301,"href":"https:\/\/welleltron.com\/de\/wp-json\/wp\/v2\/pages\/4296\/revisions\/4301"}],"up":[{"embeddable":true,"href":"https:\/\/welleltron.com\/de\/wp-json\/wp\/v2\/pages\/2541"}],"wp:attachment":[{"href":"https:\/\/welleltron.com\/de\/wp-json\/wp\/v2\/media?parent=4296"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/welleltron.com\/de\/wp-json\/wp\/v2\/categories?post=4296"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/welleltron.com\/de\/wp-json\/wp\/v2\/tags?post=4296"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}